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H
Surface Mount High Performance AlInGaP LED Indicators Technical Data
SunPower Series HSMA-TX25 HSMD-TX25 HSMJ-TX25
Features
* Outstanding LED Material Efficiency * Exceptional Light Output Over a Wide Range of Drive Currents * Colors: 590 nm Amber, 603 nm Orange, and 615 nm Reddish-Orange * Compatible with Automatic Placement Equipment * Compatible with Convective IR, Vapor Phase Reflow, and TTW Solder Processes * Packaged in 12 mm or 8 mm Tape on 7" or 13" Diameter Reels * EIA Standard Package * Low Package Profile * Non-diffused Package Excellent for Backlighting and Coupling to Light Pipes
Description
The LED material used in these devices is the very efficient absorbing Substrate aluminum indium gallium phosphide (AS AlInGaP), capable of producing high light output over a wide range of drive currents. These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering, through the wave (TTW) soldering, and conductive epoxy attachment processes. The package size and configuration conform to the EIA-535
BAAC standard specification for case size 3528 tantalum capacitors. The folded leads permit dense placement and provide an external solder joint for ease of inspection. These devices are non-diffused, providing high intensity for applications such as backlighting, light pipe illumination, and front panel indication.
Device Selection Guide
Amber d = 590 nm HSMA-T425 HSMA-T525 HSMA-T625 HSMA-T725 Orange d = 603 nm HSMD-T425 HSMD-T525 HSMD-T625 HSMD-T725 Reddish-Orange d = 615 nm HSMJ-T425 HSMJ-T525 HSMJ-T625 HSMJ-T725 Description 12 mm Tape, 7" Reel, 2000 Devices 12 mm Tape, 13" Reel, 8000 Devices 8 mm Tape, 7" Reel, 2000 Devices 8 mm Tape, 13" Reel, 8000 Devices
5964-9352E
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Package Dimensions
3.5 0.2 (0.138 0.008)
2.8 0.2 (0.110 0.008)
2.2 NOM. (0.087)
2.7 NOM. (0.106) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
CATHODE NOTCH 3.1 NOM. (0.122)
1.9 0.2 (0.075 0.008) 0.7 MIN. (0.028) 0.1 (0.004) NOM. 0.8 0.3 (0.031 0.012) (2 PLACES) 2.2 0.1 (0.087 0.004)
1.3 (0.050) MIN.
Tape and Reel Specifications
Hewlett Packard surface mount LEDs are packaged tape and reel in accordance with EIA-481A, Taping of Surface Mount
Components for Automatic Placement. This packaging system is compatible with tapefed automatic pick and place systems. Each reel is sealed in a
USER FEED DIRECTION
vapor barrier bag for added protection. Bulk packaging in vapor barrier bags is available upon special request.
CATHODE
PITCH: 4 mm (0.157 IN.)
T T ED LR WA EK HC A P
h
p
REEL DIAMETER: 178 mm (7 IN.) OR 330 mm (13 IN.)
CARRIER TAPE WIDTH: 12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
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Absolute Maximum Ratings at TA = 25C
DC Forward Current[1,4,5] ............................................................ 50 mA Peak Forward Current[2] ........................................................... 200 mA Average Forward Current ........................................................... 45 mA (at IPEAK = 200 mA, f 1 KHz)[2] Transient Forward Current (10 s Pulse)[3] .............................. 500 mA Reverse Voltage (IR = 100 A) ......................................................... 5 V LED Junction Temperature ............................................................ 95C Operating Temperature Range ....................................... -40C to +85C Storage Temperature Range .......................................... -40C to +85C Reflow Soldering Temperatures Convective IR ...................... 235C Peak, above 183C for 90 seconds Vapor Phase ........................................................ 215C for 3 minutes
Notes: 1. Derate linerally as shown in Figure 4. 2. Refer to Figure 5 to establish pulsed operating conditions. 3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. 4. Drive currents between 5 mA and 30 mA are recommended for best long term performance. 5. Operation at currents below 5 mA is not recommended, please contact your HewlettPackard sales representative.
Optical Characteristics at TA = 25C
Luminous Intensity IV (mcd) @ 10 mA Min. Typ. 10 10 10 25 25 25 Peak Wavelength PEAK (nm) Typ. 592 607 621 Color, Dominant Wavelength d[1] (nm) Typ. 590 603 615 Viewing Angle 2 1/2 Degrees[2] Typ. 120 120 120 Luminous Efficacy v (lm/w) 480 370 263
Part Number HSMA-TX25 HSMD-TX25 HSMJ-TX25
Notes: 1. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25C
Forward Voltage VF (Volts) @ IF = 10 mA Typ. Max. 1.9 1.9 1.9 2.4 2.4 2.4 Reverse Breakdown VR (Volts) @ IR = 100 A Min. Typ. 5 5 5 25 25 25 Capacitance C (pF) VF = 0, f = 1 MHz Typ. 40 40 40 Speed of Response s (ns) Time Constant e-t/ s Typ. 13 13 13
Part Number HSMA-TX25 HSMD-TX25 HSMJ-TX25
Thermal Resistance RJ-PIN (C/W) 180 180 180
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1.0
200
IF - FORWARD CURRENT - mA
AMBER ORANGE
180 160 140 120 100 80 60 40 20 0 1.0 1.5 2.0 2.5 3.0
RELATIVE INTENSITY
REDDISH ORANGE
0.5
0 550
594 600 607
621
650
700
WAVELENGTH - nm
VF - FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs. Wavelength.
Figure 2. Forward Current vs. Forward Voltage.
5.0
55 50
60
IAVG - AVERAGE CURRENT - mA
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
4.0
IF - FORWARD CURRENT - mA
45 40 35 30 25 20 15 10 5 RJ-A = 439 C/W RJ-A = 244 C/W
50
f > 1 KHz
40 f > 300 Hz 30 f > 100 Hz 20
3.0
2.0
1.0
10
0 0 10 20 30 40 50 IF - DC FORWARD CURRENT - mA
0 0 10 20 30 40 50 60 70 80 90 100 110 TA - AMBIENT TEMPERATURE - C
0 50
100
150
200
IPEAK - PEAK FORWARD CURRENT - mA
Figure 3. Relative Luminous Intensity vs. Forward Current.
Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJ Max = 95C.
Figure 5. Maximum Average Current vs. Peak Forward Current.
1.0 0.9 0.8
NORMALIZED INTENSITY
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 100
- ANGULAR DISPLACEMENT - DEGREES
Figure 6. Relative Intensity vs. Angular Displacement.
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Recommended Printed Circuit Board Attachment Pad Geometries
INFRARED/VAPOR PHASE REFLOW SOLDERING
4.45 (0.175)
COMPONENT LOCATION ON PAD
2.41 (0.095)
1.65 (0.065)
CONDUCTIVE ATTACHMENT
4.45 (0.175)
COMPONENT LOCATION ON PAD
2.41 (0.095)
1.65 (0.065) 0.64 (0.025) SQ. CENTERED HOLE NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Convective IR Reflow Soldering
For information on convective IR reflow soldering, refer to the Supplement to Application Note 1060, Surface Mounting SMT LED Components.
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